RM938(HF) is a no-clean, rosin-based flux paste developed for the attachment of lead-free solder balls to BGA and CSP components. It features a halogen-free activation flux system, making it suitable for environmentally friendly manufacturing processes. The paste delivers reliable performance across a wide range of reflow profiles, both in air and nitrogen atmospheres.

FG003 is a no clean, rosin-based flux paste developed for the attachement of lead-free solder spheres to BGA and CSP applications.
The flux formulation employs a halide-activated system with high activity, making it suitable for a wide range of applications.
It provides consistent and reliable performance across a broad range of reflow profiles in both air and nitrogen environments.