Halogen Free Solder Paste
LFA-300
ACS-LF980K2
LFA-300 is a clear residue, activated lead-free solder paste formulated for SMT and electronic assembly process applications. It features a halogen-free flux system that promotes optimal wetting on lead-free solder joints. The paste incorporates SnAgCu solder powder that exhibit reliable performance.
ACS-LF980K2 is a lead free solder paste corresponds to ROL0 classification in J-STD-004 standard requirements. It corporates with solder powder with alloy compositon of SnAgCu.
Low Temperature Curing Solder Paste
ACS-Bi3500A
ACS-Bi5000
ACS-Bi3500A is a lead-free solder paste formualted with SnBiAg1 solder powder, utilizing a non-eutectic low-temperature alloy with a melting point lower than that of SAC305. The flux system complies with ROL0 classification under JIS standards.
ACS-Bi5000 is a solder paste composed of bismuth specifically developed for low-temperature reflow soldering applications.
By utilizing Sn-Bi solder powder, a melting point of approximately 138 °C is achieved.
- Non-eutectic and low temperature solder alloy suitable for SMT assembly process with temperature sensitive substrates and components.
- Lower reflow peak temperature reduces energy consumption in SMT process.
- Reduces component warpage and other defects such as HiP and NWO defects with lower temperature used.
- Good soldering performance.
Location
32, Hala Rapat Baru 24,
Kawasan Perindustrian Ringan Kinta Jaya,
31350 Ipoh, Perak Darul Ridzuan, Malaysia.
Email: saless@asahi-kagaku.com.my
Phone Number: 05-311 1600
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