Frequently Asked Questions
(FAQs)

Asahi Chemical Research Lab (M) offers a wide range of soldering materials, including solder paste, liquid flux, flux paste, SMT bonding adhesives, flux and coating removers, solder resist ink and conductive paste solutions.

Technical Data Sheets (TDS) for commonly requested solder products are available. If a specific data sheet is not listed on our website, please contact our technical team for further assistance.

Asahi Chemical Research Lab (M)’s soldering materials are developed for a wide range of electronics and industrial applications, including household electronics, automotive systems, LED lighting, and other specialized sectors.

Yes. ALL Asahi Chemical Research Lab (M)’s products are compliant with RoHS and REACH regulations.

Voiding in BGA solder joints can be reduced by using Asahi Chemical Research Lab (M)’s low-void paste series and by following the recommended reflow profile to optimize flux activation and outgassing behavior.

Typical curing condition is 120-150 ℃ for 5 minutes using either a reflow oven or a dedicated curing oven.

Asahi Chemical’s Liquid Flux is used to remove oxides, enhance solder wetting and aperture fill, and improve solder joint quality in wave soldering, selective soldering, and rework applications.

Yes. Certificates of Analysis (COA), Safety Data Sheet (SDS/ MSDS), and Technical Data Sheet (TDS) are provided with shipment upon purchase.

Yes. Trial samples are available for evaluation, subject to product availability and application requirements. Kindly contact our team for more information!

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touch with us now

We’re here to help! Whether you have a question about our services, need assistance or want to provide feedback, our team is ready to assist you.

  • Email: saless@asahi-kagaku.com.my
  • Phone: 05-311 1600

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