ASAHI CHEMICAL RESEARCH LAB (M) SDN BHD

Surface-Mounted Technology
Adhesive (SMT)

SA-33P-2M

SA-51-2

SA-33P-2M is a single component, epoxy type adhesive designed for securing SMT chip components onto the surface of printed circuit board prior to wave soldering process.
It is supplied as a red-colored paste and has a shelf life of three months.

SA-51-2 is one component type, thermosetting epoxy adhesives designed for the temporary fixation of chip components on PWBs.

  • Suitable for high speed dispensing
  • Excellent storage stability
  • Practical adhesive strength can be obtained at standard curing temperature 120-150 °C
  • Minimal stringing and sagging during application.
  • VOC free
  • Practical adhesion strength can be obtained at 100-110 °C curing temperature.
  • Suitable for high speed application due to no stringing and sagging.
  • High adhesion strength prevent from falling off the chip component in soldering process.
Technical Data Sheet
Technical Data Sheet

Location

32, Hala Rapat Baru 24,
Kawasan Perindustrian Ringan Kinta Jaya,
31350 Ipoh, Perak Darul Ridzuan, Malaysia.

Email: saless@asahi-kagaku.com.my
Phone Number: 05-311 1600

Pages

© 2026 ASAHI CHEMICAL RESEARCH LAB (M) SDN BHD

Powered by
►
Necessary cookies enable essential site features like secure log-ins and consent preference adjustments. They do not store personal data.
None
►
Functional cookies support features like content sharing on social media, collecting feedback, and enabling third-party tools.
None
►
Analytical cookies track visitor interactions, providing insights on metrics like visitor count, bounce rate, and traffic sources.
None
►
Advertisement cookies deliver personalized ads based on your previous visits and analyze the effectiveness of ad campaigns.
None
Powered by