HOME
|
ABOUT US
|
PRODUCTS
|
DISTRIBUTORS
|
CONTACT US
Liquid Flux
Solder Paste
Flux Paste
Cleaner
SMT Adhesive
Silver Metallization Paste
Conductive Paste
Carbon Paste / Copper Paste
Strip Mask
Heat Curing Solder Resist for FPC
Home
Products
Flux Paste
Flux Paste
Flux Paste
Product
Application
RM934
No-clean rosin based flux paste, designed for attaching eutectic lead solder sphere to Ball Grid Arrays (BGA) or chip Scale Packages (CSP)
RM938(HF)
No-clean rosin based flux paste, designed for attaching lead free solder sphere to Ball Grid Arrays (BGA) or Chip Scale Packages (CSP), Halogen Free
Asahi Chemical Research Lab (M) Sdn. Bhd.
32, Hala Rapat Baru 24,
Kawasan Perindustrian Ringan Kinta Jaya,
31350 Ipoh, Perak, Malaysia.
TEL: +60-5-3111600 FAX: +60-5-3111599
ISO 9001:2008 certified
Copyright © 2012 - 2016 Asahi Chemical Research Lab (M) Sdn. Bhd. All Rights Reserved.
