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Flux Paste

Flux Paste

Product Application
RM934 No-clean rosin based flux paste, designed for attaching eutectic lead solder sphere to Ball Grid Arrays (BGA) or chip Scale Packages (CSP)
RM938(HF) No-clean rosin based flux paste, designed for attaching lead free solder sphere to Ball Grid Arrays (BGA) or Chip Scale Packages (CSP), Halogen Free

Asahi Chemical Research Lab (M) Sdn. Bhd.

32, Hala Rapat Baru 24,
Kawasan Perindustrian Ringan Kinta Jaya,
31350 Ipoh, Perak, Malaysia.
TEL: +60-5-3111600      FAX: +60-5-3111599

ISO 9001:2008 certified