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Flux Paste

Product Application
RM934 No-clean rosin based flux paste, designed for attaching eutectic lead solder sphere to Ball Grid Arrays (BGA) or chip Scale Packages (CSP)
RM938(HF) No-clean rosin based flux paste, designed for attaching lead free solder sphere to Ball Grid Arrays (BGA) or Chip Scale Packages (CSP), Halogen Free

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